240-lead thermally enhanced MQFP_PQ4 package, 225-ball plastic ball grid array (PBGA), 240-lead hermetic CQFP package RoHS compliant packages KEY FEATURES—PROCESSOR CORE.

Super Harvard Architecture 4 independent buses for dual data fetch, instruction fetch, and nonintrusive I/O 32-bit IEEE .

................................................. 4 SHARC Family Core Architecture ............................ 4 Memory and I/O Interface Features ........................... 5 Development Tools ............................................... 8 Eval.

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